diener electronic  |  Plasma-Surface-Technology Plasma Plasma systems Surface-Technology
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STANDART PLASMA SYSTEMS

 

[ Electron Microscopy]

 

PLASMA SYSTEM FEMTO UHP - PLASMA CLEANER


 
  1. switchgear cabinet
W 345 mm x H 220 mm x D 420 mm

2. chamber
Ø: 80 mm, L: 270 mm
materials: quartz or borosilicate glass
chambervolume: approx. 2 litre

3. gas supply
one gas channel through needle valve

4. generator
40 KHz / 100 W infinitely variable
or
13,56 MHz / 100 W infinitely variable

5. electrode
outside of the glass chamber
capacitive linking

6. control
semi-automatic,
process time by timer

7. connections
gas: 6mm Swagelok
power supply: 220-240V /
16 A 50-60 Hz

8. vacuum pump
rotary vane pump
pumping speed: 1,5 m3/h
the pump can run with O2
 
FEMTO - Plasmasystems for the electron microscopy - C by Diener electronic GmbH + Co. KG - TEM sample holder

FEMTO - Plasmasystems for the electron microscopy - C by Diener electronic GmbH + Co. KG - SEM sample holder

 

 

 

   
 

PLASMA SYSTEM PICO UHP - PLASMA CLEANER


 
  1. switchgear cabinet
W 550 mm x H 330 mm x D 500 mm
weight: approx. 30 kg (without pump)
2. chamber
Ø: 130 mm, L: 300 mm
materials: quartz or borosilicate glass
chambervolume: approx. 4 litre

3. gas supply
2 gas channel through needle valves

4. generator
40 KHz / 200 W infinitely variable
or
13,56 MHz / 100 W infinitely variable

5. electrode
outside of the glass chamber
capacitive linking

6. control
semi-automatic,
process time by timer

7. connections
gas: 6mm Swagelok
power supply: 220-240V /
16 A 50-60 Hz

8. vacuum pump
rotary vane pump
pumping speed: 2,5 m3/h
the pump can run with O2

 

 
PICO - Plasmasystems for the electron microscopy - plasma etcher - C by Diener electronic GmbH + Co. KG

PICO - Plasmasystems for the electron microscopy - plasma cleaner - C by Diener electronic GmbH + Co. KG

PICO - Plasmasystems for the electron microscopy - plasma asher - C by Diener electronic GmbH + Co. KG

 

Plasma equipment: Electron Microscopy, a short overview


The electron microscope is a microscope that can magnify very small details with high resolving power due to the use of electrons as the source of illumination, magnifying at levels up to 2,000,000 times.

The original form of electron microscopy, Transmission electron microscopy (TEM) involves a high voltage electron beam emitted by a cathode and formed by magnetic lenses. The electron beam that has been partially transmitted through the very thin ( and so semitransparent for electrons ) specimen carries information about the inner structure of the specimen. The spatial variation in this information (the "image") is then magnified by a series of magnetic lenses until it is recorded by hitting a fluorescent screen, photographic plate, or light sensitive sensor such as a CCD ( charge-coupled device) camera. The image detected by the CCD may be displayed in real time on a monitor or computer.

In addition there is a Reflection Electron Microscope (REM). Like TEM, this technique involves electron beams incident on a surface, but instead of using the transmission (TEM) or secondary electrons (SEM), the reflected beam is detected. This technique is typically coupled with Reflection High Energy Electron Diffraction and Reflection high energy loss spectrum (REELS). Another variation is Spin-Polarized Low-Energy Electron Microscopy (SPLEEM), which is used for looking at the microstructure of magnetic domains.


Plasma technologies: Sample preparing with Plasmatechnology

The TEM and REM samples and the TEM sample holder are cleaned with plasma.

Mostly 15 minutes with oxygen plasma is sufficient.

During the plasma process all organic elements like grease, oil and carbon black are eliminated. The operation of the plasmasystem is very simple.

The sources of errors inside the REM And TEM are clearly reduced. The dwell time during the measurement with REM and TEM is significant increased. Normally oxygen is used as process gas. For oxidation sensitive parts hydrogen is also used. Dielectric samples especially for the reflection electron microscope have to be treaten with a thin conductive layer to avoid electrical charge. This layer is normally done with plasmacoating using a sputter coater with gold or carbon is vaporized.

For the Transmission Electron Microscope (TEM) the samples have to be treaten with different kinds of processes until they have a thickness of max. 1 micron.

Very common is the ion-etch-process with that the samples are spark eroded via an ion beam.

The plasmatechnology was introduced to the TEM and REM Technologie within the 80ties due to the fact of detection the asbestos difficulties. The asbestos analysis was developed

Thereby the carbon compounds are ashed in so called plasmaasher After the plasma ashing the pure asbestos fibres becomes visible. The pure fibres are analysable with TEM and REM.

The plasmatechnology is also very useful for general polymere analysis. It is possible to uncover for example glasfibres and other unorganic fillers. The polymere is ashed with that process. It is a so called plasma ashing.

For the failure analysis in the ceramic technology Si3N4 samples are etched.

Diener electronic supplies always the right machine concept from TEM sample holder cleaning, asbestos ashing to ceramic Si3N4 etching.


Machine program for the TEM sample holder and sample cleaning


Diener electronic supplies two machine sizes for the TEM sample holder cleaning and the samples.

With those machines the TEM sample holder and the samples are able to treat complete in the vacuum chamber.

There is also the possibility to infeed the TEM sample holders from outside in the chamber.

If you choose the Version with that you infeed the TEM sample holder from outside it is necessary to check the dimensions together with Diener electronic. Each diameter is realizable

Because of the fact that the processes for the TEM sample holder cleaning are almost the same the control of the machine is designed very simple.

The vacuum chambers are made of glass to ensure the the high purity of the TEM sample holder and the samples.
   
   
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