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ATMOSPHERIC PLASMA - PLASMABEAM
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[ APPLICATIONS AND EFFECTS ]
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The processes of surface
cleaning and activation are carried out by the reaction of the reactive
particles contained in the active gas beam (radicals). In addition,
the loose sticking particles on the surface to be treated will be
removed by the compressed air accelerated active gas beam. |
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The PlasmaBeam is suited as a pretreatment
device for the following processes:
- Gluing
- Bonding
- Printing
- Soldering
- Welding
- Coating
on the following types of material: plastic, elastomers,
metal, glass, ceramics and hybrid materials.
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The active gas beam from the plasma nozzle
is always free of HV-potential. This allows the use of this device
for a variety of processes
in the electronic industry like: |
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- Cleaning of bond pads prior to wire bonding;
- Cleaning
of LCD- contacts and activation prior to heat-seal bonding;
- Activation
of electronic devices prior to printing
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The surface treatment with PlasmaBeam
is a continuous process. The speed of treatment (V) and the distance
between plasma nozzle and surface to be treated (D) are the most
important parameters for reaching the desired surface properties.
The change of these parameters can change the pretreatment effect
drastically. |
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