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Plasma Plasma systems Surface-Technology

專業術語

電漿物理常用術語

下列辭彙是電漿物理界最重要的一些術語﹒

注意︰為了要找到你所要查的術語，請用你的瀏覽器搜尋功能，或是在搜尋字母表內的字母上點一下，就可找到這個字母開頭所有術語。

Index

1 13,56 MHz,

2 2,45 GHz, 27,12 MHz,

4 40 kHz,

A ABS, Acid, Acrylic, Activation, Active species, Adhesion, Adhesion promoters, Adsorption, AFM, Aluminium, Aluminium Oxide, Anisotropic, Anode, Antiadhesive layers, Applications, Arc, Areas of application, Argon (Ar), Auger effect, Automotive engineering,

B Barrel reactor, Barrier layers, BGA, Bias voltage, Binding energy, Bonding,

C Case hardening, Cathode, Chamber, Charge-exchange collision, Chemical etching, Chemisorption, Chromium, Circuit board, Cleaning, Cleaning aluminium, Cleaning copper, Coating, Coating adhesion, Coating thickness, Components of plasma systems, Contact angle, Copper, Corona discharge, Corrosion, Cratering, Cross-cut tape test, CVD,

D Degreasing, Desmear process, Desorption, Direct current source / alternating voltage source, DLC layers, Downstream reactor, Duplex surface engineering,

E Electrode, Electron, Electron volt, Electronegative plasma, Electropositive plasma, Epilam coats, Epitaxy, ESCA, Etching, Etching mask, Etching of glass, Etching of PCBs,

F Finish, Fluorescent tube, Fluxing agent, Foil treatment, Funktionalization,

G Gallium Arsenide, Gas discharge, GDOS, Generator, Glass, Glow,

H Hard coatings, HMDSO, Hydrogen, Hydrophilic layers, Hydrophilicity, Hydrophobic, Hydrophobic layers,

I IC, Induction, Inductive plasma, Industrial pretreatment, Ion, Ion implantation, Ion measuring sensor, Ion plating, Ionization, Isotope, Isotropic,

L Langmuir probe, Lead frame, LIGA process, Lightning discharge, Lithography, Low pressure plasma,

M Magazine, Magnetic mirror, Magnetron, Mask, Mean free path length, MEMS, Metal, MFC / Mass-Flow-Controller, Microsandblasting, Microwave technology, Modification,

N Neon light tube, Neutron, Non neutral plasmas, Nucleon,

O OAUGDP, Optical coating, Overetching, Oxygen,

P PACVD, Painting, Painting of plastics, Parallel plate reactor, PCB, PE (Polyethylene), Permeation, Photon, Physical etching, Physisorption, Pirani sensor, Plasma, Plasma asher, Plasma boriding, Plasma carbonitriding, Plasma carburising, Plasma chemistry, Plasma cleaner, Plasma colour, Plasma diffusion, Plasma etcher, Plasma etching, Plasma hardening, Plasma nitriding, Plasma nitrocarburising, Plasma polymerisation, Plasma spray coating, Plasma technology, Plasmaasher, Plasmacleaner, Plasmaetcher, Plastic, Plastic coating, Polyamide (PA), Polybutylene Terephthalat, Polycarbonate (PC), Polyethylene terephthalat (PET), Polymerization, Polyolefins, Polyoxymethylen (POM), Polypropylene (PP), Polystyrene (PS), Polytetrafluourethylene (PTFE), Positive column, Preparation before sticking, Pretreatment, Principle of plasma process, Printed circuit board, Process gas, Proton, PVC,

R Reactive ion plating (RIP), Recipient, Release agent residues, Release agents, RIE, Roots pump, Rotary drum, Rotary vane pump,

S SEM, Sheath, Silicon, Silicon carbide, Silicon dioxide, Silicon nitride, Silicone, Silver, SIMS, Small flanges, Soldering, Sputtering, Stainless steel, Sticking, Sticking in automotive engineering, Sticking of glass, Sticking PE, Sulfur hexafluoride, Surface energy, Surface oxide, Surface radical, Surface technology,

T Tesla, Test ink, Tetrafluoromethane, Thornton diagram, Titanium carbide, Titanium nitride, TOS-SIMS, Trench, Turbomolecular pump,

U Ultraviolet, UV radiation,

V Vapour Deposition,

W Wetting,

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