GLOSSARY OF TERMS

[ TERMS USED IN PLASMA PHYSICS ]

In the following please find a glossary of the most important terms in the field of plasma physics.

Note: In order to find words you are looking for, please use the search function of your browser (press CTRL+F at the same time and enter your searchword) or simply click on the letters of the alphabet below to find the corresponding terms beginning with this letter.

 1 

13,56 MHz,

 2 

2,45 GHz, 27,12 MHz,

 4 

40 kHz,

 A 

ABS, Acid, Acrylic, Activation, Active species, Adhesion, Adhesion promoters, Adsorption, AFM, Aluminium, Aluminium Oxide, Anisotropic, Anode, Antiadhesive layers, Applications, Arc, Areas of application, Argon (Ar), Auger effect, Automotive engineering,

 B 

Barrel reactor, Barrier layers, BGA, Bias voltage, Binding energy, Bonding,

 C 

Case hardening, Cathode, Chamber, Charge-exchange collision, Chemical etching, Chemisorption, Chromium, Circuit board, Cleaning, Cleaning aluminium, Cleaning copper, Coating, Coating adhesion, Coating thickness, Components of plasma systems, Contact angle, Copper, Corona discharge, Corrosion, Cratering, Cross-cut tape test, CVD,

 D 

Degreasing, Desmear process, Desorption, Direct current source / alternating voltage source, DLC layers, Downstream reactor, Duplex surface engineering,

 E 

Electrode, Electron, Electron volt, Electronegative plasma, Electropositive plasma, Epilam coats, Epitaxy, ESCA, Etching, Etching mask, Etching of glass, Etching of PCBs,

 F 

Finish, Fluorescent tube, Fluxing agent, Foil treatment, Funktionalization,

 G 

Gallium Arsenide, Gas discharge, GDOS, Generator, Glass, Glow,

 H 

Hard coatings, HMDSO, Hydrogen, Hydrophilic layers, Hydrophilicity, Hydrophobic, Hydrophobic layers,

 I 

IC, Induction, Inductive plasma, Industrial pretreatment, Ion, Ion implantation, Ion measuring sensor, Ion plating, Ionization, Isotope, Isotropic,

 L 

Langmuir probe, Lead frame, LIGA process, Lightning discharge, Lithography, Low pressure plasma,

 M 

Magazine, Magnetic mirror, Magnetron, Mask, Mean free path length, MEMS, Metal, MFC / Mass-Flow-Controller, Microsandblasting, Microwave technology, Modification,

 N 

Neon light tube, Neutron, Non neutral plasmas, Nucleon,

 O 

OAUGDP, Optical coating, Overetching, Oxygen,

 P 

PACVD, Painting, Painting of plastics, Parallel plate reactor, PCB, PE (Polyethylene), Permeation, Photon, Physical etching, Physisorption, Pirani sensor, Plasma, Plasma asher, Plasma boriding, Plasma carbonitriding, Plasma carburising, Plasma chemistry, Plasma cleaner, Plasma colour, Plasma diffusion, Plasma etcher, Plasma etching, Plasma hardening, Plasma nitriding, Plasma nitrocarburising, Plasma polymerisation, Plasma spray coating, Plasma technology, Plasmaasher, Plasmacleaner, Plasmaetcher, Plastic, Plastic coating, Polyamide (PA), Polybutylene Terephthalat, Polycarbonate (PC), Polyethylene terephthalat (PET), Polymerization, Polyolefins, Polyoxymethylen (POM), Polypropylene (PP), Polystyrene (PS), Polytetrafluourethylene (PTFE), Positive column, Preparation before sticking, Pretreatment, Principle of plasma process, Printed circuit board, Process gas, Proton, PVC,

 R 

Reactive ion plating (RIP), Recipient, Release agent residues, Release agents, RIE, Roots pump, Rotary drum, Rotary vane pump,

 S 

SEM, Sheath, Silicon, Silicon carbide, Silicon dioxide, Silicon nitride, Silicone, Silver, SIMS, Small flanges, Soldering, Sputtering, Stainless steel, Sticking, Sticking in automotive engineering, Sticking of glass, Sticking PE, Sulfur hexafluoride, Surface energy, Surface oxide, Surface radical, Surface technology,

 T 

Tesla, Test ink, Tetrafluoromethane, Thornton diagram, Titanium carbide, Titanium nitride, TOF-SIMS, Trench, Turbomolecular pump,

 U 

Ultraviolet, UV radiation,

 V 

Vapour Deposition,

 W 

Wetting,