diener electronic  |  Plasma-Surface-Technology Plasma Plasma systems Surface-Technology
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 Hydrogen 
Diatomic gas (H2) employed as process gas in plasma processes. Owing toits low weight, hydrogen has got a poor sputtering effect, but a goodeffect in removing reducible surface layers, e. g. surface oxides onmetals. Lightest of the chemical elements, consisting of one proton andone electron. The isotopes deuterium and tritium contain one and twoadditional neutrons in the nucleus, respectively.

   
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